CD54HC574F3A vs 74HC574NB feature comparison

CD54HC574F3A Rochester Electronics LLC

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74HC574NB NXP Semiconductors

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 20
Reach Compliance Code unknown unknown
Additional Feature BROADSIDE VERSION OF 374 BROADSIDE VERSION OF 374
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T20 R-PDIP-T20
JESD-609 Code e0
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level NOT SPECIFIED
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 1 1
HTS Code 8542.39.00.01
Length 26.73 mm
Load Capacitance (CL) 50 pF
Propagation Delay (tpd) 45 ns
Qualification Status Not Qualified
Seated Height-Max 4.2 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

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