CD54HC30F3A vs M74HC30F1 feature comparison

CD54HC30F3A Texas Instruments

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M74HC30F1 STMicroelectronics

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Pbfree Code Yes No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-GDIP-T14
JESD-609 Code e0 e0
Length 19.56 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 1 1
Number of Inputs 8 8
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.04 mA
Prop. Delay@Nom-Sup 39 ns 31 ns
Propagation Delay (tpd) 195 ns 31 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm 5 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1

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