CD54HC257F/3
vs
CD54HC258H/3
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
HARRIS SEMICONDUCTOR
|
Package Description |
,
|
DIE,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
HC/UH
|
HC/UH
|
JESD-30 Code |
R-CDIP-T16
|
X-XUUC-N16
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
INVERTED
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
UNSPECIFIED
|
Package Code |
DIP
|
DIE
|
Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
Package Style |
IN-LINE
|
UNCASED CHIP
|
Propagation Delay (tpd) |
265 ns
|
210 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
Terminal Position |
DUAL
|
UPPER
|
Base Number Matches |
3
|
2
|
Package Equivalence Code |
|
DIE OR CHIP
|
|
|
|
Compare CD54HC257F/3 with alternatives
Compare CD54HC258H/3 with alternatives