CD54HC20F/3A
vs
5962G9651803VXC
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
AEROFLEX COLORADO SPRINGS
|
| Package Description |
,
|
DFP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| Family |
HC/UH
|
AC
|
| JESD-30 Code |
R-CDIP-T14
|
R-CDFP-F14
|
| JESD-609 Code |
e0
|
e4
|
| Logic IC Type |
NAND GATE
|
AND GATE
|
| Number of Functions |
2
|
4
|
| Number of Inputs |
4
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
150 ns
|
17 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
GOLD
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
2
|
3
|
| Part Package Code |
|
DFP
|
| Pin Count |
|
14
|
| HTS Code |
|
8542.39.00.01
|
| Length |
|
8.626 mm
|
| Package Code |
|
DFP
|
| Screening Level |
|
MIL-PRF-38535 Class V
|
| Seated Height-Max |
|
2.575 mm
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Terminal Pitch |
|
1.27 mm
|
| Total Dose |
|
500k Rad(Si) V
|
| Width |
|
6.475 mm
|
|
|
|
Compare CD54HC20F/3A with alternatives
Compare 5962G9651803VXC with alternatives