CD54HC20F/3A
vs
5962G9651803VXC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
HARRIS SEMICONDUCTOR
AEROFLEX COLORADO SPRINGS
Package Description
,
DFP,
Reach Compliance Code
unknown
unknown
Family
HC/UH
AC
JESD-30 Code
R-CDIP-T14
R-CDFP-F14
JESD-609 Code
e0
e4
Logic IC Type
NAND GATE
AND GATE
Number of Functions
2
4
Number of Inputs
4
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
150 ns
17 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
GOLD
Terminal Form
THROUGH-HOLE
FLAT
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
2
3
Part Package Code
DFP
Pin Count
14
HTS Code
8542.39.00.01
Length
8.626 mm
Package Code
DFP
Screening Level
MIL-PRF-38535 Class V
Seated Height-Max
2.575 mm
Supply Voltage-Nom (Vsup)
5 V
Terminal Pitch
1.27 mm
Total Dose
500k Rad(Si) V
Width
6.475 mm
Compare CD54HC20F/3A with alternatives
Compare 5962G9651803VXC with alternatives