CD54HC153W
vs
MC74AC257NG
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
ONSEMI
|
Package Description |
DIE,
|
PLASTIC, DIP-16
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
HC/UH
|
AC
|
JESD-30 Code |
X-XUUC-N16
|
R-PDIP-T16
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Number of Functions |
2
|
4
|
Number of Inputs |
4
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIE
|
DIP
|
Package Shape |
UNSPECIFIED
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
IN-LINE
|
Propagation Delay (tpd) |
48 ns
|
9 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Position |
UPPER
|
DUAL
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
DIP
|
Pin Count |
|
16
|
Factory Lead Time |
|
4 Weeks
|
JESD-609 Code |
|
e3
|
Length |
|
19.175 mm
|
Max I(ol) |
|
0.012 A
|
Output Characteristics |
|
3-STATE
|
Package Equivalence Code |
|
DIP16,.3
|
Peak Reflow Temperature (Cel) |
|
260
|
Prop. Delay@Nom-Sup |
|
9 ns
|
Seated Height-Max |
|
4.44 mm
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Terminal Finish |
|
TIN
|
Terminal Pitch |
|
2.54 mm
|
Width |
|
7.62 mm
|
|
|
|
Compare CD54HC153W with alternatives
Compare MC74AC257NG with alternatives