CD54HC153W vs MC74AC257NG feature comparison

CD54HC153W Intersil Corporation

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MC74AC257NG onsemi

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR ONSEMI
Package Description DIE, PLASTIC, DIP-16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH AC
JESD-30 Code X-XUUC-N16 R-PDIP-T16
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 2 4
Number of Inputs 4 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE DIP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Propagation Delay (tpd) 48 ns 9 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 16
Factory Lead Time 4 Weeks
JESD-609 Code e3
Length 19.175 mm
Max I(ol) 0.012 A
Output Characteristics 3-STATE
Package Equivalence Code DIP16,.3
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 9 ns
Seated Height-Max 4.44 mm
Supply Voltage-Nom (Vsup) 5 V
Terminal Finish TIN
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare CD54HC153W with alternatives

Compare MC74AC257NG with alternatives