CD54HC11F3A vs MC74F11JD feature comparison

CD54HC11F3A Texas Instruments

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MC74F11JD Motorola Mobility LLC

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Pbfree Code Yes
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC MOTOROLA INC
Part Package Code DIP DIP
Package Description CERAMIC, DIP-14 DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Family HC/UH F/FAST
JESD-30 Code R-GDIP-T14 R-GDIP-T14
JESD-609 Code e0 e0
Length 19.94 mm 19.495 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.0052 A
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.04 mA 9.7 mA
Prop. Delay@Nom-Sup 30 ns
Propagation Delay (tpd) 150 ns 6.5 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO NO
Technology CMOS TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1

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Compare MC74F11JD with alternatives