CD54HC109F3A
vs
TC74HC109AP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
TOSHIBA CORP
Package Description
DIP-16
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-CDIP-T16
R-PDIP-T16
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
J-KBAR FLIP-FLOP
J-KBAR FLIP-FLOP
Max Frequency@Nom-Sup
20000000 Hz
25000000 Hz
Max I(ol)
0.004 A
0.004 A
Number of Bits
2
2
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
265 ns
190 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
fmax-Min
60 MHz
67 MHz
Base Number Matches
4
1
Part Package Code
DIP
Pin Count
16
Length
19.25 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
4.45 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Compare CD54HC109F3A with alternatives
Compare TC74HC109AP with alternatives