CD54ACT174F3A
vs
TC74ACT174P
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
TOSHIBA CORP
Package Description
DIP,
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
ACT
ACT
JESD-30 Code
R-GDIP-T16
R-PDIP-T16
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
6
6
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
4.45 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
7.62 mm
Base Number Matches
3
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
16
Length
19.25 mm
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Package Equivalence Code
DIP16,.3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supply Current-Max (ICC)
0.08 mA
Propagation Delay (tpd)
11.5 ns
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
fmax-Min
85 MHz
Compare CD54ACT174F3A with alternatives
Compare TC74ACT174P with alternatives