CD5225BE3
vs
1N4372
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
| Package Description |
S-XXUC-N2
|
HERMETIC SEALED, GLASS PACKAGE-2
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-30 Code |
S-XUUC-N1
|
O-LALF-W2
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
1
|
2
|
| Package Body Material |
UNSPECIFIED
|
GLASS
|
| Package Shape |
SQUARE
|
ROUND
|
| Package Style |
UNCASED CHIP
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Reference Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Form |
NO LEAD
|
WIRE
|
| Terminal Position |
UPPER
|
AXIAL
|
| Voltage Tol-Max |
5%
|
10%
|
| Working Test Current |
20 mA
|
20 mA
|
| Base Number Matches |
1
|
17
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DO-7
|
| Pin Count |
|
2
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| Case Connection |
|
ISOLATED
|
| Dynamic Impedance-Max |
|
29 Ω
|
| JEDEC-95 Code |
|
DO-35
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
1
|
| Operating Temperature-Max |
|
175 °C
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare CD5225BE3 with alternatives
Compare 1N4372 with alternatives