CD4696 vs MSP1N5239B-1E3 feature comparison

CD4696 MACOM

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MSP1N5239B-1E3 Microsemi Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer M/A-COM TECHNOLOGY SOLUTIONS INC MICROSEMI CORP
Package Description DIE-1 O-LALF-W2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 0.08 Ω
Forward Voltage-Max (VF) 1.5 V
JESD-30 Code S-XUUC-N1 O-LALF-W2
Number of Elements 1 1
Number of Terminals 1 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material UNSPECIFIED GLASS
Package Shape SQUARE ROUND
Package Style UNCASED CHIP LONG FORM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Reference Voltage-Nom 9.1 V 9.1 V
Reverse Current-Max 1 µA
Reverse Test Voltage 6.9 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Form NO LEAD WIRE
Terminal Position UPPER AXIAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage Tol-Max 5% 5%
Working Test Current 0.05 mA 20 mA
Base Number Matches 7 1
Part Package Code DO-35
Pin Count 2
Case Connection ISOLATED
JEDEC-95 Code DO-204AH
JESD-609 Code e3
Power Dissipation-Max 0.48 W
Qualification Status Not Qualified
Terminal Finish MATTE TIN

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