CD4566BE
vs
CD4566BE
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTERSIL CORP
|
HARRIS SEMICONDUCTOR
|
Package Description |
DIP-16
|
DIP-16
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Count Direction |
UP
|
UP
|
JESD-30 Code |
R-PDIP-T16
|
R-PDIP-T16
|
JESD-609 Code |
e0
|
e0
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Load/Preset Input |
NO
|
NO
|
Logic IC Type |
DECADE COUNTER
|
DECADE COUNTER
|
Max I(ol) |
0.00041999999999999996 A
|
0.00041999999999999996 A
|
Mode of Operation |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Prop. Delay@Nom-Sup |
1300 ns
|
1300 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
4
|
4
|
|
|
|
Compare CD4566BE with alternatives
Compare CD4566BE with alternatives