CD4555BFMSH
vs
MC14555BAL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Family
4000/14000/40000
Input Conditioning
STANDARD
JESD-30 Code
R-GDIP-T16
R-XDIP-T16
JESD-609 Code
e0
e0
Load Capacitance (CL)
50 pF
Logic IC Type
2-LINE TO 4-LINE DECODER
OTHER DECODER/DRIVER
Max I(ol)
0.00035999999999999997 A
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
0.6 mA
Prop. Delay@Nom-Sup
594 ns
Propagation Delay (tpd)
594 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535V;38534K;883S
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Total Dose
1M Rad(Si) V
Base Number Matches
2
3
Power Supplies
5/15 V
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