CD4555BEE4 vs HEF4555BPN feature comparison

CD4555BEE4 Texas Instruments

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HEF4555BPN NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description ROHS COMPLIANT, PLASTIC, DIP-16 DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Family 4000/14000/40000 4000/14000/40000
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e4
Length 19.305 mm 21.6 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 2-LINE TO 4-LINE DECODER 2-LINE TO 4-LINE DECODER
Max I(ol) 0.0015 A 0.00035999999999999997 A
Number of Bits 4
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED 245
Power Supply Current-Max (ICC) 3 mA
Prop. Delay@Nom-Sup 190 ns 295 ns
Propagation Delay (tpd) 440 ns 230 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.7 mm
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Width 7.62 mm 7.62 mm
Base Number Matches 1 1

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