CD4536BPWG4
vs
CD4536BF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
HARRIS SEMICONDUCTOR
Part Package Code
TSSOP
Package Description
TSSOP,
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Count Direction
UP
Family
4000/14000/40000
JESD-30 Code
R-PDSO-G16
R-XDIP-T16
JESD-609 Code
e4
e0
Length
5 mm
Load/Preset Input
YES
Logic IC Type
BINARY COUNTER
Mode of Operation
SYNCHRONOUS
Moisture Sensitivity Level
1
Number of Bits
24
Number of Functions
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
TSSOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
8000 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
NICKEL PALLADIUM GOLD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
Width
4.4 mm
fmax-Min
2.5 MHz
Base Number Matches
1
6
ECCN Code
EAR99
Package Equivalence Code
DIP16,.3
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