CD4536BDMSR
vs
CD4536BPWE4
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
TEXAS INSTRUMENTS INC
Package Description
,
TSSOP,
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-CDIP-T16
R-PDSO-G16
JESD-609 Code
e0
e4
Load/Preset Input
YES
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Number of Functions
1
1
Number of Terminals
16
16
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Lead (Sn/Pb)
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
Part Package Code
TSSOP
Pin Count
16
Samacsys Manufacturer
Texas Instruments
Count Direction
UP
Length
5 mm
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
2500000 Hz
Max I(ol)
0.004 A
Mode of Operation
SYNCHRONOUS
Moisture Sensitivity Level
1
Number of Bits
24
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
0.1 mA
Prop. Delay@Nom-Sup
3000 ns
Propagation Delay (tpd)
8000 ns
Schmitt Trigger
NO
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Temperature Grade
MILITARY
Terminal Pitch
0.65 mm
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
Width
4.4 mm
fmax-Min
2.5 MHz
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