CD4515BM
vs
HEF4515BTD
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NEXPERIA
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOIC-24
|
|
| Pin Count |
24
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Additional Feature |
ADDRESS LATCHES
|
|
| Family |
4000/14000/40000
|
|
| Input Conditioning |
LATCHED
|
|
| JESD-30 Code |
R-PDSO-G24
|
|
| JESD-609 Code |
e4
|
|
| Length |
15.4 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
4-LINE TO 16-LINE DECODER
|
OTHER DECODER/DRIVER
|
| Max I(ol) |
0.0015 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
16
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
24
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Polarity |
INVERTED
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SOP
|
|
| Package Equivalence Code |
SOP24,.4
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Packing Method |
TUBE
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Supply Current-Max (ICC) |
3 mA
|
|
| Prop. Delay@Nom-Sup |
370 ns
|
|
| Propagation Delay (tpd) |
970 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.65 mm
|
|
| Supply Voltage-Max (Vsup) |
18 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7.5 mm
|
|
| Base Number Matches |
1
|
3
|
|
|
|
Compare CD4515BM with alternatives