CD4502BD vs HEF4502BD feature comparison

CD4502BD Texas Instruments

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HEF4502BD NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH COMMON INHIBIT FOR ALL BITS WITH COMMON INHIBIT FOR ALL BITS
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-CDIP-T16 R-GDIP-T16
Length 19.05 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 6 6
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 380 ns 170 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 3
Rohs Code No
Control Type ENABLE LOW
Load Capacitance (CL) 50 pF
Max I(ol) 0.0023 A
Package Equivalence Code DIP16,.3
Prop. Delay@Nom-Sup 170 ns

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