Findchips: Compare CD4093BCM vs HEF4093BT,653

CD4093BCM vs HEF4093BT,653 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	Yes
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	NATIONAL SEMICONDUCTOR CORP	NXP SEMICONDUCTORS
Part Package Code	SOIC	SOIC
Package Description	SOP, SOP14,.25	PLASTIC, SOT-108-1, SO-14
Pin Count	14	14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	4000/14000/40000	4000/14000/40000
JESD-30 Code	R-PDSO-G14	R-PDSO-G14
JESD-609 Code	e0	e4
Length	8.65 mm	8.65 mm
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	NAND GATE	NAND GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SOP	SOP
Package Equivalence Code	SOP14,.25	SOP14,.25
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE	SMALL OUTLINE
Propagation Delay (tpd)	450 ns	185 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	YES	YES
Seated Height-Max	1.75 mm	1.75 mm
Supply Voltage-Max (Vsup)	15 V	15 V
Supply Voltage-Min (Vsup)	3 V	3 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Finish	Tin/Lead (Sn/Pb)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	DUAL	DUAL
Width	3.9 mm	3.9 mm
Base Number Matches	4	2
Manufacturer Package Code		SOT108-1
Moisture Sensitivity Level		1
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		185 ns
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates