CD4076BFX
vs
HCF4076BEY
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
STMICROELECTRONICS
Package Description
FRIT SEALED, CERAMIC, DIP-16
PLASTIC, DIP-16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
WITH HOLD MODE; WITH DUAL OUTPUT ENABLE
WITH HOLD MODE; WITH DUAL OUTPUT ENABLE
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-GDIP-T16
R-PDIP-T16
JESD-609 Code
e0
e3
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
3000000 Hz
3000000 Hz
Max I(ol)
0.00035999999999999997 A
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.1 mm
Supply Voltage-Max (Vsup)
18 V
20 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Part Package Code
DIP
Pin Count
16
Packing Method
TUBE
Propagation Delay (tpd)
600 ns
fmax-Min
8 MHz
Compare CD4076BFX with alternatives
Compare HCF4076BEY with alternatives