CD4071BMJ/883
vs
MC14071BALDS
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
QP SEMICONDUCTOR INC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Package Description |
,
|
DIP, DIP14,.3
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Logic IC Type |
OR GATE
|
OR GATE
|
Qualification Status |
Not Qualified
|
|
Base Number Matches |
5
|
3
|
Rohs Code |
|
No
|
JESD-30 Code |
|
R-XDIP-T14
|
JESD-609 Code |
|
e0
|
Number of Terminals |
|
14
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
|
CERAMIC
|
Package Code |
|
DIP
|
Package Equivalence Code |
|
DIP14,.3
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE
|
Power Supplies |
|
5/15 V
|
Schmitt Trigger |
|
NO
|
Surface Mount |
|
NO
|
Technology |
|
CMOS
|
Temperature Grade |
|
MILITARY
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Pitch |
|
2.54 mm
|
Terminal Position |
|
DUAL
|
|
|
|
Compare CD4071BMJ/883 with alternatives