CD4066BCN
vs
MAX4066CEE+
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
HARRIS SEMICONDUCTOR
MAXIM INTEGRATED PRODUCTS INC
Package Description
,
QSOP-16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPST
SPST
Qualification Status
Not Qualified
Not Qualified
Base Number Matches
1
4
Pbfree Code
Rohs Code
Part Package Code
SOIC
Pin Count
16
ECCN Code
EAR99
JESD-30 Code
R-PDSO-G16
JESD-609 Code
e3
Length
4.89 mm
Moisture Sensitivity Level
1
Normal Position
NO
Number of Channels
1
Number of Functions
4
Number of Terminals
16
On-state Resistance Match-Nom
0.3 Ω
On-state Resistance-Max (Ron)
75 Ω
Operating Temperature-Max
70 °C
Operating Temperature-Min
Output
SEPARATE OUTPUT
Package Body Material
PLASTIC/EPOXY
Package Code
SSOP
Package Equivalence Code
SSOP16,.25
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Switch-off Time-Max
75 ns
Switch-on Time-Max
125 ns
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
Terminal Pitch
0.635 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
Compare CD4066BCN with alternatives
Compare MAX4066CEE+ with alternatives