CD4050BMJ/883
vs
CD4050BD3
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
E2V TECHNOLOGIES PLC
|
ROCHESTER ELECTRONICS LLC
|
| Package Description |
,
|
PACKAGE-16
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Base Number Matches |
3
|
3
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
16
|
| Additional Feature |
|
CMOS-TTL LEVEL TRANSLATOR
|
| Family |
|
4000/14000/40000
|
| JESD-30 Code |
|
R-CDIP-T16
|
| JESD-609 Code |
|
e0
|
| Logic IC Type |
|
BUFFER
|
| Moisture Sensitivity Level |
|
NOT SPECIFIED
|
| Number of Functions |
|
6
|
| Number of Inputs |
|
1
|
| Number of Terminals |
|
16
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
|
DIP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Supply Voltage-Max (Vsup) |
|
18 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
NO
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|