CD4050BM
vs
CD4050BDT
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| Logic IC Type |
BUFFER
|
BUFFER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Base Number Matches |
5
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Package Description |
|
GREEN, PLASTIC, MS-012AC, SOIC-16
|
| Pin Count |
|
16
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Family |
|
4000/14000/40000
|
| JESD-30 Code |
|
R-PDSO-G16
|
| JESD-609 Code |
|
e4
|
| Length |
|
9.9 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.018 A
|
| Moisture Sensitivity Level |
|
1
|
| Number of Functions |
|
6
|
| Number of Inputs |
|
1
|
| Number of Terminals |
|
16
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
SOP
|
| Package Equivalence Code |
|
SOP16,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Supply Current-Max (ICC) |
|
0.12 mA
|
| Prop. Delay@Nom-Sup |
|
140 ns
|
| Propagation Delay (tpd) |
|
140 ns
|
| Schmitt Trigger |
|
NO
|
| Seated Height-Max |
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
|
18 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Supply Voltage-Nom (Vsup) |
|
10 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
3.9 mm
|
|
|
|
Compare CD4050BM with alternatives
Compare CD4050BDT with alternatives