CD4050BF vs MC14050BAL feature comparison

CD4050BF Texas Instruments

Buy Now Datasheet

MC14050BAL Motorola Mobility LLC

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC MOTOROLA INC
Part Package Code DIP DIP
Package Description CERAMIC, DIP-16 DIP,
Pin Count 16 16
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Additional Feature CMOS-TTL LEVEL TRANSLATOR CMOS-TTL LEVEL TRANSLATOR
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-GDIP-T16
JESD-609 Code e0 e0
Length 19.56 mm 19.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.0064 A
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.06 mA
Prop. Delay@Nom-Sup 140 ns
Propagation Delay (tpd) 140 ns 80 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 5.08 mm 4.19 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 10 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 4 3

Compare CD4050BF with alternatives

Compare MC14050BAL with alternatives