CD4046BE98 vs HEF4046BDF feature comparison

CD4046BE98 Harris Semiconductor

Buy Now

HEF4046BDF NXP Semiconductors

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Package Description DIP, DIP16,.3 DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T16 R-GDIP-T16
JESD-609 Code e0
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 1
Analog IC - Other Type PHASE LOCKED LOOP
Number of Functions 1
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Width 7.62 mm

Compare CD4046BE98 with alternatives

Compare HEF4046BDF with alternatives