CD4044BMJ
vs
HEF4044BP,652
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Package Description
DIP, DIP16,.3
DIP-16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-XDIP-T16
R-PDIP-T16
JESD-609 Code
e0
e4
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
R-S LATCH
R-S LATCH
Number of Bits
1
4
Number of Functions
4
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
350 ns
185 ns
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
1
Part Package Code
DIP
Pin Count
16
Manufacturer Package Code
SOT38-4
Factory Lead Time
4 Weeks
Family
4000/14000/40000
Length
21.6 mm
Output Polarity
TRUE
Packing Method
BULK
Propagation Delay (tpd)
185 ns
Seated Height-Max
4.7 mm
Supply Voltage-Max (Vsup)
15 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Trigger Type
LOW LEVEL
Width
7.62 mm
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