CD4044BD
vs
HEF4044BT,652
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
THOMSON CONSUMER ELECTRONICS
NXP SEMICONDUCTORS
Package Description
DIP-16
SOP, SOP16,.25
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-XDIP-T16
R-PDSO-G16
Logic IC Type
R-S LATCH
R-S LATCH
Number of Bits
1
4
Number of Functions
4
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP16,.3
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
7
1
Part Package Code
SOP
Pin Count
16
Manufacturer Package Code
SOT109-1
Family
4000/14000/40000
JESD-609 Code
e4
Length
9.9 mm
Load Capacitance (CL)
50 pF
Moisture Sensitivity Level
1
Output Polarity
TRUE
Packing Method
BULK
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
185 ns
Propagation Delay (tpd)
185 ns
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
15 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
LOW LEVEL
Width
3.9 mm
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