CD4035BMJ
vs
HEF4035BDB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Package Description
DIP, DIP16,.3
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
J AND KBAR SERIAL INPUT
J AND KBAR SERIAL INPUT
Count Direction
RIGHT
RIGHT
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-GDIP-T16
R-GDIP-T16
JESD-609 Code
e0
Length
19.43 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
PARALLEL IN PARALLEL OUT
PARALLEL IN PARALLEL OUT
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
CONFIGURABLE
CONFIGURABLE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
500 ns
340 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
15 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
7.62 mm
fmax-Min
1.5 MHz
5 MHz
Base Number Matches
2
1
Compare CD4035BMJ with alternatives
Compare HEF4035BDB with alternatives