CD4035BF vs HEC4035BDB feature comparison

CD4035BF General Electric Solid State

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HEC4035BDB NXP Semiconductors

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer GENERAL ELECTRIC SOLID STATE NXP SEMICONDUCTORS
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Base Number Matches 7 1
Package Description DIP,
Additional Feature J AND KBAR SERIAL INPUT
Count Direction RIGHT
Family 4000/14000/40000
JESD-30 Code R-GDIP-T16
Load Capacitance (CL) 50 pF
Logic IC Type PARALLEL IN PARALLEL OUT
Number of Bits 4
Number of Functions 1
Number of Terminals 16
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Output Polarity CONFIGURABLE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Propagation Delay (tpd) 340 ns
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Trigger Type POSITIVE EDGE
Width 7.62 mm
fmax-Min 5 MHz

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