CD4029BF3A
vs
HEF4029BT
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NXP SEMICONDUCTORS
Part Package Code
DIP
SOIC
Package Description
HERMETICALLY SEALED, CERAMIC, DIP-16
SOP, SOP16,.25
Pin Count
16
16
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
Additional Feature
BINARY/BCD COUNT OPTION; TCO OUTPUT
BINARY/BCD COUNT OPTION; TCO OUTPUT; COUNT ENABLE INPUT
Count Direction
BIDIRECTIONAL
BIDIRECTIONAL
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-GDIP-T16
R-PDSO-G16
JESD-609 Code
e0
Length
19.56 mm
9.9 mm
Load Capacitance (CL)
50 pF
50 pF
Load/Preset Input
YES
YES
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Max Frequency@Nom-Sup
2000000 Hz
2000000 Hz
Max I(ol)
0.0015 A
0.00035999999999999997 A
Mode of Operation
SYNCHRONOUS
SYNCHRONOUS
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP16,.3
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Packing Method
TUBE
Power Supply Current-Max (ICC)
0.03 mA
Prop. Delay@Nom-Sup
260 ns
Propagation Delay (tpd)
500 ns
290 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
1.75 mm
Supply Voltage-Max (Vsup)
18 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
3.9 mm
fmax-Min
5.5 MHz
15 MHz
Base Number Matches
1
4
Compare CD4029BF3A with alternatives
Compare HEF4029BT with alternatives