CD40257BFMSH vs HD14512BFP feature comparison

CD40257BFMSH Harris Semiconductor

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HD14512BFP Renesas Electronics Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer HARRIS SEMICONDUCTOR RENESAS ELECTRONICS CORP
Package Description DIP, DIP16,.3 SOP,
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-PDSO-G16
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.00035999999999999997 A
Number of Functions 4 1
Number of Inputs 2 8
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 513 ns
Propagation Delay (tpd) 513 ns 750 ns
Qualification Status Not Qualified Not Qualified
Screening Level 38535V;38534K;883S
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Total Dose 1M Rad(Si) V
Base Number Matches 1 1
Part Package Code SOIC
Pin Count 16
Length 10.06 mm
Seated Height-Max 2.2 mm
Width 5.5 mm

Compare CD40257BFMSH with alternatives

Compare HD14512BFP with alternatives