CD4024BMN
vs
CD4024BFMS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
HARRIS SEMICONDUCTOR
Package Description
DIP, DIP14,.3
,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Count Direction
UP
UP
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
JESD-609 Code
e0
Length
19.18 mm
Load Capacitance (CL)
50 pF
50 pF
Load/Preset Input
NO
YES
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Max Frequency@Nom-Sup
1500000 Hz
Mode of Operation
ASYNCHRONOUS
ASYNCHRONOUS
Number of Bits
7
7
Number of Functions
1
1
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
350 ns
486 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
15 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
NEGATIVE EDGE
NEGATIVE EDGE
Width
7.62 mm
fmax-Min
1.5 MHz
12 MHz
Base Number Matches
3
2
Compare CD4024BMN with alternatives
Compare CD4024BFMS with alternatives