CD40175BMTG4
vs
HEF40174BT
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
PHILIPS SEMICONDUCTORS
|
Part Package Code |
SOIC
|
|
Package Description |
SOP, SOP16,.25
|
SOP, SOP16,.25
|
Pin Count |
16
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
4000/14000/40000
|
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e4
|
|
Length |
9.9 mm
|
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Max Frequency@Nom-Sup |
2000000 Hz
|
5000000 Hz
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
4
|
|
Number of Functions |
1
|
6
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Polarity |
COMPLEMENTARY
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP16,.25
|
SOP16,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
400 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
|
Supply Voltage-Max (Vsup) |
18 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
3.9 mm
|
|
fmax-Min |
6.5 MHz
|
|
Base Number Matches |
1
|
2
|
Max I(ol) |
|
0.00035999999999999997 A
|
|
|
|
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