CD40163BD3 vs HEF40161BP feature comparison

CD40163BD3 Harris Semiconductor

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HEF40161BP NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR NXP SEMICONDUCTORS
Package Description , DIP, DIP16,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature TCO OUTPUT TCO OUTPUT
Count Direction UP UP
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-CDIP-T16 R-PDIP-T16
Load/Preset Input YES YES
Logic IC Type BINARY COUNTER BINARY COUNTER
Mode of Operation SYNCHRONOUS SYNCHRONOUS
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 200 ns 220 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Base Number Matches 2 2
Rohs Code No
Part Package Code DIP
Pin Count 16
Length 21.6 mm
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 2500000 Hz
Max I(ol) 0.00035999999999999997 A
Moisture Sensitivity Level 1
Package Equivalence Code DIP16,.3
Seated Height-Max 4.7 mm
Terminal Pitch 2.54 mm
Width 7.62 mm
fmax-Min 18 MHz

Compare CD40163BD3 with alternatives

Compare HEF40161BP with alternatives