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CD4013BCM vs HEC4013BT,118 feature comparison

CD4013BCM Texas Instruments

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HEC4013BT,118 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Package Description SOP, SOP14,.25 PLASTIC, SOT-108, SO-14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e4
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Prop. Delay@Nom-Sup 350 ns 220 ns
Propagation Delay (tpd) 350 ns 220 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 3.9 mm 3.9 mm
fmax-Min 2.5 MHz 20 MHz
Base Number Matches 4 2
Pbfree Code Yes
Part Package Code SOIC
Pin Count 14
Factory Lead Time 4 Weeks
Max Frequency@Nom-Sup 7000000 Hz
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Logic » FF/Latches
Logic » FF/Latches

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