CD4012BM
vs
MC14012UBCPDS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
MOTOROLA INC
Part Package Code
DIP
Package Description
CERAMIC, DIP-14
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Texas Instruments
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDSO-G14
R-PDIP-T14
JESD-609 Code
e4
e0
Length
8.65 mm
18.86 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.0068 A
Moisture Sensitivity Level
1
Number of Functions
2
2
Number of Inputs
4
4
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP14,.25
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
0.03 mA
Prop. Delay@Nom-Sup
250 ns
Propagation Delay (tpd)
250 ns
180 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1.75 mm
4.69 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3.9 mm
7.62 mm
Base Number Matches
1
3
Compare CD4012BM with alternatives
Compare MC14012UBCPDS with alternatives