CD4011MD8 vs 5962R9662104V9X feature comparison

CD4011MD8 National Semiconductor Corporation

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5962R9662104V9X Intersil Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP INTERSIL CORP
Package Description DIE, DIE,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-XUUC-N14 R-XUUC-N14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIE DIE
Package Equivalence Code DIE OR CHIP DIE OR CHIP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP UNCASED CHIP
Propagation Delay (tpd) 250 ns 338 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Base Number Matches 2 2
Part Package Code DIE
Pin Count 14
JESD-609 Code e0
Screening Level MIL-PRF-38535 Class V
Terminal Finish TIN LEAD
Total Dose 100k Rad(Si) V

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Compare 5962R9662104V9X with alternatives