CD4011MD8
vs
5962R9662104V9X
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
INTERSIL CORP
|
Package Description |
DIE,
|
DIE,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
4000/14000/40000
|
4000/14000/40000
|
JESD-30 Code |
R-XUUC-N14
|
R-XUUC-N14
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
DIE
|
DIE
|
Package Equivalence Code |
DIE OR CHIP
|
DIE OR CHIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
Propagation Delay (tpd) |
250 ns
|
338 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
15 V
|
18 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
UPPER
|
UPPER
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
DIE
|
Pin Count |
|
14
|
JESD-609 Code |
|
e0
|
Screening Level |
|
MIL-PRF-38535 Class V
|
Terminal Finish |
|
TIN LEAD
|
Total Dose |
|
100k Rad(Si) V
|
|
|
|
Compare CD4011MD8 with alternatives
Compare 5962R9662104V9X with alternatives