CD4010UBH
vs
CD4010BMTG4
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
DIE
SOIC
Package Description
DIE,
SOP, SOP16,.25
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-XUUC-N16
R-PDSO-G16
Logic IC Type
BUFFER
BUFFER
Number of Functions
6
6
Number of Inputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
SOP
Package Equivalence Code
DIE OR CHIP
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE
Propagation Delay (tpd)
200 ns
200 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
Base Number Matches
1
2
Pbfree Code
Rohs Code
JESD-609 Code
e4
Length
9.9 mm
Load Capacitance (CL)
50 pF
Moisture Sensitivity Level
1
Output Characteristics
OPEN-DRAIN
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
200 ns
Schmitt Trigger
NO
Seated Height-Max
1.75 mm
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
Compare CD4010UBH with alternatives
Compare CD4010BMTG4 with alternatives