CD40105BFMSR vs HCF40105BEY feature comparison

CD40105BFMSR Harris Semiconductor

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HCF40105BEY STMicroelectronics

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR STMICROELECTRONICS
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature INPUT AC PARAMETRIC VALUES NOT FROM POST RADIATION MEASUREMENT; REGISTER BASED
Clock Frequency-Max (fCLK) 1.5 MHz 3 MHz
Cycle Time 900.9 ns 125 ns
JESD-30 Code R-GDIP-T16 R-PDIP-T16
JESD-609 Code e0 e0
Memory Density 64 bit 64 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 16 words 16 words
Number of Words Code 16 16
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 16X4 16X4
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535V;38534K;883S
Supply Voltage-Max (Vsup) 18 V 20 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 15 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Part Package Code DIP
Pin Count 16
Access Time-Max 370 ns
Seated Height-Max 5.1 mm
Width 7.62 mm

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