CD4007AE vs MC14070BDR2G feature comparison

CD4007AE General Electric Solid State

Buy Now Datasheet

MC14070BDR2G onsemi

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Transferred Active
Ihs Manufacturer GENERAL ELECTRIC SOLID STATE ONSEMI
Package Description DIP-14 SOIC-14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 3 1
Pbfree Code Yes
Part Package Code SOIC-14 NB
Pin Count 14
Manufacturer Package Code 751A-03
ECCN Code EAR99
Samacsys Manufacturer onsemi
Family 4000/14000/40000
JESD-609 Code e3
Length 8.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type XOR GATE
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 350 ns
Propagation Delay (tpd) 350 ns
Schmitt Trigger NO
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

Compare MC14070BDR2G with alternatives