CD4006BCN
vs
HEF4006BDB
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Package Description
PLASTIC, DIP-14
DIP,
Reach Compliance Code
unknown
unknown
Additional Feature
SHARED CLOCK BETWEEN 4 SHIFT REGISTERS; TWO 4 BIT & TWO 5 BIT SHIFT REGISTERS
SHARED CLOCK BETWEEN 4 SHIFT REGISTERS; TWO 4 BIT & TWO 5 BIT SHIFT REGISTERS
Count Direction
RIGHT
RIGHT
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDIP-T14
R-GDIP-T14
JESD-609 Code
e0
Length
19.18 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
SERIAL IN SERIAL OUT
SERIAL IN SERIAL OUT
Number of Bits
5
5
Number of Functions
4
4
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
400 ns
180 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
15 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
NEGATIVE EDGE
NEGATIVE EDGE
Width
7.62 mm
7.62 mm
fmax-Min
2.5 MHz
9 MHz
Base Number Matches
3
1
HTS Code
8542.39.00.01
Compare CD4006BCN with alternatives
Compare HEF4006BDB with alternatives