CD4002BF3A
vs
MC14002BAL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTERSIL CORP
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
DIP, DIP14,.3
DIP, DIP14,.3
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
JESD-30 Code
R-XDIP-T14
R-XDIP-T14
JESD-609 Code
e0
e0
Load Capacitance (CL)
50 pF
Logic IC Type
NOR GATE
NOR GATE
Max I(ol)
0.00035999999999999997 A
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
250 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Screening Level
38535Q/M;38534H;883B
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
3
Power Supplies
5/15 V