CD4001BMN
vs
CD4093BFMSR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
HARRIS SEMICONDUCTOR
Package Description
DIP, DIP14,.3
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDIP-T14
R-GDIP-T14
JESD-609 Code
e0
e0
Length
19.18 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NOR GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
250 ns
513 ns
Propagation Delay (tpd)
250 ns
513 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
YES
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
15 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
1
Additional Feature
RADIATION HARDENED
Max I(ol)
0.00035999999999999997 A
Screening Level
38535V;38534K;883S
Total Dose
100k Rad(Si) V
Compare CD4001BMN with alternatives
Compare CD4093BFMSR with alternatives