CD4001BCMX vs BU4001BFT1 feature comparison

CD4001BCMX Texas Instruments

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BU4001BFT1 ROHM Semiconductor

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Part Life Cycle Code Transferred Active
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ROHM CO LTD
Part Package Code SOIC SOIC
Package Description SOP, LSOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 8.7 mm
Load Capacitance (CL) 50 pF
Logic IC Type NOR GATE NOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP LSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, LOW PROFILE
Propagation Delay (tpd) 250 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.6 mm
Supply Voltage-Max (Vsup) 15 V 16 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 4.4 mm
Base Number Matches 1 2
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e2
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN COPPER
Time@Peak Reflow Temperature-Max (s) 10

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