CD4001AF vs CD4012BD3 feature comparison

CD4001AF General Electric Solid State

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CD4012BD3 Harris Semiconductor

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer GENERAL ELECTRIC SOLID STATE HARRIS SEMICONDUCTOR
Package Description , DIP-14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Base Number Matches 3 3
Rohs Code No
Family 4000/14000/40000
JESD-30 Code R-CDIP-T14
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE
Max I(ol) 0.00035999999999999997 A
Number of Functions 2
Number of Inputs 4
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Prop. Delay@Nom-Sup 250 ns
Propagation Delay (tpd) 120 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Screening Level 38535Q/M;38534H;883B
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL

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