CC2510F16RSP
vs
CC1110F16RSPR
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
CHIPCON AS
|
TEXAS INSTRUMENTS INC
|
Reach Compliance Code |
unknown
|
compliant
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
QFN
|
Package Description |
|
6 X 6 MM, ROHS COMPLIANT, MO-220, QFN-36
|
Pin Count |
|
36
|
ECCN Code |
|
5A992.C
|
HTS Code |
|
8542.39.00.01
|
JESD-30 Code |
|
S-XQCC-N36
|
JESD-609 Code |
|
e4
|
Length |
|
6 mm
|
Moisture Sensitivity Level |
|
3
|
Number of Functions |
|
1
|
Number of Terminals |
|
36
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
UNSPECIFIED
|
Package Code |
|
HVQCCN
|
Package Equivalence Code |
|
LCC36,.25SQ,20
|
Package Shape |
|
SQUARE
|
Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
0.9 mm
|
Supply Voltage-Nom |
|
3 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Telecom IC Type |
|
RF AND BASEBAND CIRCUIT
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
|
NO LEAD
|
Terminal Pitch |
|
0.5 mm
|
Terminal Position |
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
6 mm
|
|
|
|
Compare CC1110F16RSPR with alternatives