CC1310F64RHBT
vs
CC1310F64RSMR
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
HVQCCN,
|
VQFN-32
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A992.C
|
5A992.C
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
CPU Family |
CORTEX-M3
|
CORTEX-M3
|
JESD-30 Code |
S-PQCC-N32
|
S-PQCC-N32
|
JESD-609 Code |
e4
|
e4
|
Length |
5 mm
|
4 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
32
|
32
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
RAM (bytes) |
28672
|
28672
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Max |
3.8 V
|
3.8 V
|
Supply Voltage-Min |
1.8 V
|
1.8 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.4 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
5 mm
|
4 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT
|
MICROPROCESSOR CIRCUIT
|
Base Number Matches |
1
|
1
|
|
|
|
Compare CC1310F64RHBT with alternatives
Compare CC1310F64RSMR with alternatives