CC1310F128RSMT
vs
EZR32LG230FF55GR
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
SILICON LABORATORIES INC
|
Package Description |
VQFN-32
|
HVQCCN,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
5A992.C
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
CPU Family |
CORTEX-M3
|
|
JESD-30 Code |
S-PQCC-N32
|
S-XQCC-N64
|
JESD-609 Code |
e4
|
|
Length |
4 mm
|
9 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
32
|
64
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
RAM (bytes) |
28672
|
|
Seated Height-Max |
1 mm
|
0.9 mm
|
Supply Voltage-Max |
3.8 V
|
3.8 V
|
Supply Voltage-Min |
1.8 V
|
1.98 V
|
Supply Voltage-Nom |
3.3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.4 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
4 mm
|
9 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT
|
MICROPROCESSOR CIRCUIT
|
Base Number Matches |
1
|
1
|
|
|
|
Compare CC1310F128RSMT with alternatives
Compare EZR32LG230FF55GR with alternatives