CBTS3384DK,118
vs
SN74CBTD3384DBR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SSOP
|
SSOP
|
| Package Description |
SSOP,
|
GREEN, PLASTIC, SSOP-24
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
CBT/FST/QS/5C/B
|
CBT/FST/QS/5C/B
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
| JESD-609 Code |
e4
|
e4
|
| Length |
8.7 mm
|
8.2 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
10
|
5
|
| Number of Functions |
1
|
10
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
SSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Propagation Delay (tpd) |
0.25 ns
|
0.25 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.73 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Additional Feature |
|
BUS SWITCH
|
| Control Type |
|
ENABLE LOW
|
| Count Direction |
|
BIDIRECTIONAL
|
| Load Capacitance (CL) |
|
50 pF
|
| Package Equivalence Code |
|
SSOP24,.3
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Supply Current-Max (ICC) |
|
1.5 mA
|
| Technology |
|
CMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare CBTS3384DK,118 with alternatives
Compare SN74CBTD3384DBR with alternatives