CBTD3306PW,118 vs CBTD3306PWDH-T feature comparison

CBTD3306PW,118 Nexperia

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CBTD3306PWDH-T NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOP
Package Description 4.40 MM, PLASTIC, MO-153, SOT-530-1, TSSOP-8 TSSOP,
Pin Count 8 8
Manufacturer Package Code SOT530-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 8 Weeks
Samacsys Manufacturer Nexperia
Family CBT/FST/QS/5C/B CBT/FST/QS/5C/B
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e4
Length 4.4 mm 4.4 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1
Number of Bits 1 1
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP8,.25 TSSOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR, 13 INCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 0.25 ns 0.25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 40
Width 3 mm 3 mm
Base Number Matches 2 1

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